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MECHANIC Original Solder Tin Paste 183C Melting Point Welding Flux Soldering Cream Sn63/Pb37 Repair BGA CPU LED Rework Tools

Lead-free solder paste maintenance soldering tin for iPhone BGA 138 183 260 degrees environmental protection tin mud CPU tin55g

Advanced insulation technology, a high viscosity no-clean flux, it can be used for PCB, SMD reworking, as well as reballing of computer and phone chips.The mixture of high-quality alloyed powder and resinic pasty flux, which avoid the pale yellow residue, so you are easy to clean the board.

MECHANIC Lead Free Solder Fulx Paste Low Temperature 148 Degrees Welding Paste Dedicated for iPhone X XS XSMAX XR Motherboard Flux

Green Yellow Red Blue UV SOLDER MASK for PCB BGA PAINT PREVENT CORROSIVE ARCING, Soldering Paste Flux Cream Welding Fluxes Oil, UV Solder Resist for PCB UV Curable Solder Great Mast, GREEN UV Soldering Paste Flux for repairing phone motherboard PCB after soldering BGA rework, protect PCB traces from corrosion, moisture

Diagmeter 0.02mm/0.01mm insultaed copper logic board jump wire. Fully shielded and insulated, Insulated magnet jumper wire. Running Long Jumpers Without Worrying About Shorting Out Components.

High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream. Applicable to PCB, BGA, SMD, PGA repair repair, Soldering Repair cream Solder Paste Welding Fluxes for Soldering Station Tin Cream Welding Seal Grease Tools.

Cell Phone Motherboard CPU BGA Chip Removal graver for iPhone A8 9 A10 A11 CPU Removal Blade

Phone BGA Chip Remover Blade is common used disassembly tools for small and slightly smaller IC parts on the motherboard of the mobile phone, when the BGA CPU chip can not be removed, the ultra-thin blades will offer the best solution to pry out the chip easily without any damage.

Gold finger tape is made of polyimide film coated with high-temperature resistant silicone. The color is brown (amber). Gold finger tape has good adhesiveness, good applicability, high temperature resistance, solvent resistance, no tin penetration, no Residues, products with excellent electrical properties

1 Roll Sturdy Gold Alloy Copper Wire Dia 0.2 0.3 0.4 0.5 0.6 0.7 0.8 1 mm Thread Metal String Wire For DIY Beads Jewelry Making

10 Roll 100 Meters One Set Jewelry Set 0.3 0.4 Wire Diameter Wire Beading Cord String Findings DIY Wire For DIY Jewelry Makings

Qianli 007 008 009 High Quality CPU IC Glue Remover Knife Thin blade motherboard BGA chip glue Cleaning Scraping Pry Knife

5 in 1 IC Chip Repair Thin Blade CPU NAND Remover BGA Maintenance Knife Remove Glue Disassemble Phone PC Rework Processor Tools

100x100mm Silicone Thermal Pad Sheet GPU CPU Heatsink Cooling for heat sink GPU CPU Electronic Chip IC Thermal Pads

20ml BGA IC glue epoxy remover.

Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.
Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.

AMTECH NC-559-ASM 100g Leaded Free Soldering Flux Welding Paste! The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.

100% Original AMTECH Unleaded NC-559-ASM BGA Soldering Tin Cream+Syringe Push+Needle Head for Phone PCB Welding 10CC Low Residue SMD Soldering Paste Flux


100% Original AMTECH NC-559-ASM 100g Lead-Free Solder Flux Paste For SMT BGA Reballing Soldering Welding Repair Tools No Clean

0.3/0.4/0.5/0.6/0.8/1mm 63/37 FLUX 2.0% Tin Lead Tin Wire Melt Rosin Core Solder Soldering Wire Roll 40%off

MECHANIC 40g 0.2/0.3/0.4/0.5/0.6/0.8mm 63/37 Rosin Core Tin-Lead 183℃ Melting Solder Wire Welding Flux 1.0-3.0% Iron Cable Reel

1.5mm 2mm 2.5mm 3mm 3.5mm Width 1.5M Length Desoldering Braid Welding Solder Remover Wick Wire Lead Cord Flux BGA Repair Tool

PMTC BGA solder ball 250K 0.2mm 0.25mm 0.3mm 0.35mm 0.4mm 0.45mm 0.5mm 0.55mm 0.6mm 0.65mm 0.76mm leaded tin solder balls


The inside gap of original laptop’s GPU and CPU using thermal conductive pad, will be aged after long time working and losing heat dissipate peformance whcih will influence the operation of CPU and GPU seriously, the worst will appear frequently computer crash.But now one better material can instead it