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WL Precision / High temperature Universal phone motherboard Jig PCB Board Holder Fixture for phone repair

High temperature phone motherboard Jig Fixture PCB Board Holder Fixture

100% brand new and high quality
Universal PCB Holder for Mobile Phone PDA MP3 repair
The best tool for you work

MJ K22 High Temperature circuit board soldering Jig Fixture, universal PCB Board Holder Fixture for mobile phone motherboard soldering repair, Multifunction MJ K22 Universal PCB Board Holder Fixture.

High quality with Anti-static heat insulation pad. Resistance to high temperature of 500 °C, a good partner for hot air gun,make your repair work easy, maintenance : water washing detergent or soft cloth

MECHANIC Precision Tweezers AK-King High Henacity SMD Tweezer For Phone Motherboard Repair Hand Tools

2pcs Tweezers Electronics Tweezers Set Kit Hard Thick Stainless Steel Anti-Skid Forceps Precision Repair Multi Tools.

PCB Holder Repair Fixture for iPhone X XS XS MAX Motherboard Planting Tin With BGA Reballing Stencil A11 Remove Black Glue

21 pcs full set IC Chip BGA Reballing Stencil Kits Set  for iPhone XS MAX XR 8p 7 6s 6+ SE 5S 5C 5 4S iPad high quality

Mobile Phone  PCB Holder  Motherboard Holder  PCB Soldering Repair Platform  Motherboard Repair Fixture  for M obile Phone Repair.

Separation process by setting separation temperature parameters through thermostat operation .Firstly, the layered motherboard alignment pin holes will be installed on the separator heating board,Then push the button back and tighten the motherboard. Setting separation temperature recommended 200-220 Degrees .

Black Steel BGA Reballing Stencil Kit for iPhone 11 11Pro XS XS MAX XR X 8P 8 7P 7 6S 6 CPU IC Chip Tin Planting Soldering Net, High Quality Stainless Steel Reballing Stencil. Specially Designed for iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XS/XS MAX/XR/11/11Pro/11Pro Max. Make your repair work easier.

High quality 3pcs universal BGA Stencils for MTK Samsung HTC Huawei Android  Directly Heated BGA Reballing Stencils Kit

These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.

MJ CH5 Motherboard Layered Desoldering Platform A11 A12 A13 CPU Chip for iPhone X XS XSMAX 11 Pro Max Baseband Glue Removal.

JC iHeater 220V/110V Pre-heating Station Thermostat Platform heating plate for iPhone Android 11 Pro X XS MAX Motherboard Fixtur.

Qianli Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone X XS MAX 11Pro Logic Board Rework Tool.

MJ Z13 Metal Tin Planting Platform With BGA Reballing Stencil For IPhone X XS XS MAX Soldering Repair Tools.

Qianli For iPhone X XS XSMAX 11 11pro max Motherboard layering Upper and lower Rapid Separation Disassembly Platform Heating Platform.