Advanced insulation technology, a high viscosity no-clean flux, it can be used for PCB, SMD reworking, as well as reballing of computer and phone chips.The mixture of high-quality alloyed powder and resinic pasty flux, which avoid the pale yellow residue, so you are easy to clean the board.
Diagmeter 0.02mm/0.01mm insultaed copper logic board jump wire. Fully shielded and insulated, Insulated magnet jumper wire. Running Long Jumpers Without Worrying About Shorting Out Components.
High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream. Applicable to PCB, BGA, SMD, PGA repair repair, Soldering Repair cream Solder Paste Welding Fluxes for Soldering Station Tin Cream Welding Seal Grease Tools.
Cell Phone Motherboard CPU BGA Chip Removal graver for iPhone A8 9 A10 A11 CPU Removal Blade
Phone BGA Chip Remover Blade is common used disassembly tools for small and slightly smaller IC parts on the motherboard of the mobile phone, when the BGA CPU chip can not be removed, the ultra-thin blades will offer the best solution to pry out the chip easily without any damage.
Gold finger tape is made of polyimide film coated with high-temperature resistant silicone. The color is brown (amber). Gold finger tape has good adhesiveness, good applicability, high temperature resistance, solvent resistance, no tin penetration, no Residues, products with excellent electrical properties
AMTECH NC-559-ASM 100g Leaded Free Soldering Flux Welding Paste! The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.
The inside gap of original laptop’s GPU and CPU using thermal conductive pad, will be aged after long time working and losing heat dissipate peformance whcih will influence the operation of CPU and GPU seriously, the worst will appear frequently computer crash.But now one better material can instead it
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