High quality with Anti-static heat insulation pad. Resistance to high temperature of 500 °C, a good partner for hot air gun,make your repair work easy, maintenance : water washing detergent or soft cloth
Separation process by setting separation temperature parameters through thermostat operation .Firstly, the layered motherboard alignment pin holes will be installed on the separator heating board,Then push the button back and tighten the motherboard. Setting separation temperature recommended 200-220 Degrees .
Black Steel BGA Reballing Stencil Kit for iPhone 11 11Pro XS XS MAX XR X 8P 8 7P 7 6S 6 CPU IC Chip Tin Planting Soldering Net, High Quality Stainless Steel Reballing Stencil. Specially Designed for iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XS/XS MAX/XR/11/11Pro/11Pro Max. Make your repair work easier.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use. High success rate of planting tin, the solder balls can be formed once when you are proficient. Simple and convenient to use.
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